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美國Trion 離子刻蝕與沉積系統(tǒng)

價  格:詢價

產  地:更新時間:2021-01-19 15:36

品  牌:型  號:TITAN

狀  態(tài):正常點擊量:2940

400-006-7520
聯(lián)系我時,請說明是在上海非利加實業(yè)有限公司上看到的,謝謝!

上海非利加實業(yè)有限公司

聯(lián) 系 人: 上海非利加實業(yè)有限公司

電   話: 400-006-7520

傳   真: 400-006-7520

配送方式: 上海自提或三方快遞

聯(lián)系我時請說在上海非利加實業(yè)有限公司上看到的,謝謝!



美***Trion反應式離子刻蝕系統(tǒng)及沉積系統(tǒng)

Trion始于***九八九年的等離子刻蝕與沉積系統(tǒng)制造商,Trion為化合物半導體、MEMS(微機電系統(tǒng))、光電器件以及其他半導體市場提供多種設備。我們的產品在業(yè)內以系統(tǒng)占地面積*小、成本低而著稱,且設備及工藝的可靠性和穩(wěn)定性久經考驗。從整套的批量生產用設備,到簡單的實驗室研發(fā)用系統(tǒng),盡在Trion。 

批量生產用:
TITAN離子刻蝕與沉積系統(tǒng):

Titan是***套用于半導體生產的十分緊湊、全自動化、帶預真空室的等離子系統(tǒng)。

Titan具有反應離子刻蝕(RIE)配置、高密度電感耦合等離子沉積(HDICP)或等離子增強型化學汽相沉積(PECVD)配置??蓪蝹€基片或帶承片盤的基片(3”-300mm)進行處理。它還具有多尺寸批量處理功能。價格適宜且占地面積小。

刻蝕應用范圍:
 

砷化鎵、砷化鋁鎵、氮化鎵、磷化鎵、磷化銦、鋁、硅化物、鉻以及其他要求腐蝕性和非腐蝕性化學刻蝕的材料。

沉積應用范圍:
二氧化硅、氮化硅、氮氧化物和其他各種材料。

The United States Trion Technology

Reactive ion etching (RIE/ICP) system and deposition (PECVD) system

 

Founded in 1989 as a manufacturer of plasma etching and deposition systems, Trion supplies a wide range of devices to the compound semiconductor, MEMS(micro-electromechanical systems), optoelectronic devices, and other semiconductor markets.Our products are well known in the industry for their minimal system footprint and low cost, as well as the proven reliability and stability of equipment and processes.Trion has everything from a complete set of mass production equipment to a simple laboratory development system.

 

Mass production:

TITAN ion etching and deposition system:

 

Titan is a very compact, fully automated plasma system with a pre-vacuum chamber for semiconductor production.

 

Titan has reactive ion etching (RIE) configurations, high-density inductively coupled plasma deposition (HDICP), or plasma-enhanced chemical vapor deposition (PECVD) configurations.A single substrate or substrate (3 "-300mm) with a backing plate can be processed.It also has multi-dimensional batch processing capabilities.Affordable and small footprint.

 

Etching application:

Gallium arsenide, gallium arsenide, gallium nitride, gallium phosphate, indium phosphate, aluminum, silicides, chromium and other materials requiring corrosive and non-corrosive chemical etching.

 

Application range of sedimentation:

 

Silicon dioxide, silicon nitride, nitrogen oxides and various other materials.


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